New high reliability laminates for aerospace and wireless applications

The XT/duroid™ 8000 series high performance thermoplastic laminate materials and the RT/duroid® 6035HTC high thermal conductivity laminates are recent introductions of Rogers Advanced Circuits Materials Division (ACM), Rogers Corp. (NYSE:ROG).

The XT/duroid 8000 Series includes XT/duroid 8000 laminates for simpler multilayer designs (less than 6 layers) and XT/duroid 8100 laminates for constructions consisting of six or more layers. Highly reliable and halogen-free flame retardant, XT/duroid laminates are thermally and chemically robust with melting points higher than PTFE materials and an estimated maximum Relative Thermal Index (RTI) greater than 210° C (410° F), making them suitable for rugged military and aerospace applications, including airborne lightning strike protection circuits, phased-array antennas and unmanned aerial vehicles (UAVs).

XT/duroid 8000 laminates from Rogers Corporation will be on display at the Radio & Wireless Week expo.

These laminates feature a z-axis dielectric constant of 3.23 ±0.05 at 10 GHz and a dissipation factor of 0.0035 or less at 10 GHz. They deliver stable electrical performance over wide frequency ranges, with a low thermal coefficient of dielectric constant of +7 ppm/° C from -50 to +150° C.

For complex multilayer circuit constructions requiring excellent stability, XT/duroid 8100 laminates have a reinforced woven-glass resin system for added dimensional stability. That makes them capable of supporting multilayer circuits while providing the thermal and chemical ruggedness, as well as outstanding electrical performance, of XT/duroid 8000 laminates.

The XT/duroid 8100 laminates feature z-axis dielectric constants of 3.54±0.05 (0.002 in.) & 3.32±0.05 (0.004 in.) at 10 GHz and dissipation factors of 0.0049 (0.002 in.) & .0038 in. (0.004 in.) at 10 GHz. They deliver stable electrical performance over wide frequency ranges, with a low thermal coefficient of dielectric constant of +9 ppm/° C from -50 to +150° C.

Both XT/duroid 8000 and 8100 laminates are available with a dielectric thickness of 0.002 in. (0.0508 mm) with 0.5-oz low profile reverse treated electrodeposited copper foil cladding. XT/duroid 8100 is also available with dielectric thickness of 0.004 in. (0.1016 mm).

The RT/duroid® 6035HTC is a high-thermal-conductivity (HTC) laminate material engineered for low loss in high-power circuits. With a thermal conductivity of 1.44 W/m-K and a loss tangent of 0.0013 @ 10 GHz, this combination of high thermal conductivity and low dielectric loss translates into improved amplifier performance.

They feature a relative dielectric constant of 3.5 at 10 GHz, making them suitable for a wide range of circuits, including amplifiers, couplers, filters, and power combiners/dividers employed in avionic and other military and high reliability systems. They are available in a variety of dielectric thicknesses and cladding options to support a wide range of high frequency circuit applications.

Rogers Corp. will introduce these laminates to the market at the IEEE Radio & Wireless Week expo at the Renaissance Glendale Hotel & Spa in Glendale, Arizona January 17-18, 2011. Rogers (Booth #2)

Rogers Corp.
www.rogerscorp.com

::Design World::