Sealevel Systems, Inc. and ADLINK Technology, a global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), announced a partnership designed to provide industry-leading computing and I/O solutions for OEMs using ADLINK’s computer-on-module (COM) and Sealevel’s custom carrier board technology. The agreement comes as a result of a number of successful collaborations between the two companies across vertical markets, including oil and gas, military and automotive applications.
ADLINK’s COM products provide the generic computing engine along with storage, Ethernet, keyboard/mouse and display common to most applications. The modular architecture allows future upgrade of the processor subsystem and offers superior life cycle management of systems and applications. ADLINK’s computer-on-modules are available based on COM Express®, Qseven® and SMARC® specifications.
Sealevel’s custom carrier boards provide the application-specific circuitry particular to a customer’s unique application. Common I/O carrier board features can include serial, digital and analog I/O, all of which can be designed to meet the I/O count, voltage ranges and connector types required by the application.
“Using ADLINK computer-on-modules accelerates the design process and allows Sealevel to focus on our core competencies of I/O and system-level design,” said Ben O’Hanlan, president of Sealevel. “ADLINK modules provide the latest computing technology with the reliability our customers demand.”
“Sealevel’s expertise in I/O and custom system design compliments our COM architecture by providing customers a trusted resource to supplement their in-house engineering capabilities,” said Elizabeth Campbell, general manager of ADLINK. “The combination of ADLINK’s rugged next-generation COM modules with a Sealevel custom carrier board can provide significant competitive advantages.”
Filed Under: TECHNOLOGIES + PRODUCTS, I/O modules