AI Technology, Inc. (AIT) claims to have solved one of the technically more challenging problems in wafer level semiconductor packaging to achieve conductive die-attach film adhesive (DAF) of 20-micron thickness. While DAF adhesive at the wafer level is becoming more prevalent in die-attach for memory modules in precision bonding and thin packages, thermally conductive and…
Increased Manufacturing Capacity of Advanced 10 Micron Wafer Level DAF
AI Technology, Inc. (AIT), a pioneer in the technology of self-supporting die-attach film (DAF) adhesive has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power…
AI Technology, Inc. Releases Second Generation COOL-PAD™ CPR 7154
AI Technology, Inc. (AIT) introduces COOL-PAD™ CPR7154, a new class of thermal interface material that dispenses like a thermal pad, but performs with characteristics like that of a grease or gel when device temperatures increase to above 45°C. COOL-PAD™ CPR7154 is optimized to accommodate large areas with different heights and gaps of less than 3-mil…