Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. It has an advantageously long working life of 2-4 hours at 75°F for a 100 gram mass. Its smooth paste consistency makes it convenient to apply and use. Shore D hardness is 70-80 when mixed in a one to one mix ratio…
Epoxy features low coefficient of thermal expansion
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. EP30LTE-2 is a highly dimensionally stable epoxy system with low linear…
Electrically conductive epoxy meets NASA low outgassing specifications
Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. Featuring a silver filler, EP3HTS-LO is electrically conductive with a low volume resistivity of less than…