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Two-part epoxy adhesive for structural bonding has long pot life

By Leslie Langnau | July 16, 2018

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Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. It has an advantageously long working life of 2-4 hours at 75°F for a 100 gram mass. Its smooth paste consistency makes it convenient to apply and use. Shore D hardness is 70-80 when mixed in a one to one mix ratio by weight or volume. Moreover, certain properties of the epoxy can be altered by adjusting the mix ratio. For example, adding more of Part A to obtain a 2:1 mix ratio will produce a formulation with a more rigid cure. Conversely, adding more of Part B in a 1:2 mix ratio will provide the epoxy with a more forgiving cure. EP21ND-LP cures at room temperature or more rapidly at elevated temperatures.

epoxy adhesive

EP21ND-LP achieves high strength, durable bonds and has excellent gap filling properties. Its tensile strength ranges between 6,000 to 7,000 psi. It withstands thermal cycling and has a coefficient of thermal expansion of 50-55 x 10-6/in/in/°C. This dimensionally stable epoxy also offers reliable electrical insulation with a volume resistivity greater than 1014 ohm-cm.

The standard color of Part A is gray and Part B amber, although the epoxy can be formulated in a wide array of colors. It can be used in the electronic, electrical, computer, appliance, chemical, aerospace and specialty OEM industries. It is available in ½ pint, pint, quart and gallon kits.
Master Bond Two Component Epoxy Systems

Master Bond EP21ND-LP adheres well to numerous substrates such as metals, composites, glass, ceramics and many types of rubbers and plastics, forming high physical strength bonds.

Master Bond
www.masterbond.com

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  • Home
  • Articles
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
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  • 3D CAD Models
    • PARTsolutions
    • TraceParts
  • Leadership
    • 2020 Winners
    • 2019 Winners
    • LEAP Awards
  • Resources
    • Subscribe
    • DIGITAL ISSUES
      • EE World Digital Issues
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    • Motion Design Guide Library
    • Podcasts
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    • Webinars
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