Lenze Americas (Booth #1824) will showcase its precision control and drive solutions for packaging applications at EXPO PACK Mexico, June 18-21, 2013 in Mexico City.
EXPO PACK is the premier packaging and processing technology event for Mexico and Central America. EXPO PACK Booth #1824 will feature Lenze’s newest drive solutions for achieving high performance and efficiency in packaging machines and processes.
The Lenze EXPO PACK booth will highlight its extensive product portfolio, including important new solutions for packaging automation.
- Lenze p500 Controller combines a maintenance-free controller, logic (PLC), motion and visualization in a single, panel-mounted device for controller-based automation systems with central motion control or visualization within a drive-based automation system.
- Lenze i700 Servo Inverter features real-time EtherCAT bus and a compact, flexible design that’s easy to install for high performance dynamic motor control of synchronous and asynchronous motors.
- Lenze Controller 3200 C equipped with an Atom processor offers a compact and robust design, large power reserves and comprehensive features for optimum productivity in central control of high precision manufacturing packaging operations.
Featuring a practical, real-world ‘EASY’ engineering approach, Lenze will demonstrate how users can design, select components and implement a packaging machine or automation architecture tailored to a customer’s requirements. The Lenze Drive Solution Designer (DSD) for drive dimensioning is just one tool in the Lenze suite of software engineering tools that span the entire machine lifecycle from initial design concept to installation and operation.
Filed Under: Automation components, Packaging, Motion control • motor controls