Cinch Connectivity Solutions, a Bel group company, announces the commercial availability of its CIN::APSE stacking connector series.
These solderless, high density, stacking interconnects are used for board-to-board, flex-to-board and component-to-board applications. CIN::APSE stacking connectors are found in applications where a mezzanine style PCB layout is utilized to reduce space and weight. The CIN::APSE 1.0 mm pitch accommodates high-density circuits between boards.
Its mechanical contacts are durable for applications that require several cycles of disconnections for modifications or testing. The mechanical contacts also reduce the need for soldering and subsequent inspection. CIN::APSE is one the most widely implemented solderless, high speed interconnects in the industry. With a flight-proven history, CIN::APSE stacking connectors are found on military, aerospace and satellite applications worldwide.
Cinch Connectivity Solutions
Filed Under: Connectors (electrical) • crimp technologies