In 2007, two Applied Materials scientists developed a hybrid-module solar concept and brought it to commercialization. They coupled several materials designated for solar while implementing semiconductor properties and using production methods from flat-panel display industries. None of the materials used are new, but they have been packaged together to create a higher performance device.The hybrid…

Applied Materials, Inc. today released its Applied Tetra™ Reticle Clean, the industry’s only wet clean system that delivers damage-free, >99% particle removal efficiency for 32nm-and-beyond photomasks. Enabling customers to exceed 32nm specifications for critical mask cleaning applications, the compact Tetra Reticle Clean system also sets a new standard for productivity, offering up to four times…

Applied Materials, Inc. today unveiled a comprehensive portfolio of fully characterized processes for building high-k/metal gate (HK/MG) structures in high volume production. Starting at the 45nm node for logic chips, transistors are so small that conventional gate materials are no longer effective, allowing excessive current leakage that heats up the transistor and consumes excessive power.…

Applied Materials, Inc. (Nasdaq: AMAT) announced its new Applied Opus™ AdvantEdge™ Metal Etch, the industry’s fastest, most advanced system for etching sub-70nm aluminum interconnects in leading-edge Flash and DRAM memory devices. The system removes a critical etch bottleneck for customers by employing a process-optimized 5-chamber configuration (3 etch, 2 strip). Compared to standard 4-chamber metal…

Applied Materials, Inc. today announced its innovative Applied DuraPad&trade CMP polishing pad technology for 200mm chemical mechanical planarization (CMP) systems. The DuraPad has >30% longer pad life than existing pads for increased CMP system productivity and delivers compelling cost of ownership savings to customers. Robust manufacturing methodology enables exceptional pad-to-pad reproducibility with less than 2%…