Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings

Forza Integrated Production Services achieve practical yields for back-side illumination sensors

By Lee Teschler | November 10, 2021

Share

Forza Silicon — a business of AMETEK and leader of advanced image sensor and mixed-signal integrated circuit designs for imaging applications — recently used its Integrated Production Services (IPS) to enable the production of high-speed image sensors that employ back side illumination (BSI) technology.

While BSI sensors have been available for more than 10 years in many cellphones and standard digital cameras, the manufacturing process is inherently more difficult than comparable front side forzaillumination (FSI) sensors as it requires additional manufacturing steps. The realities of semiconductor economics have also made it difficult to transfer the technology from the high production volumes of standard cameras to the lower volumes of high-speed imaging sensors. Overcoming these issues, Forza leveraged its IPS capabilities to optimize the manufacturing process for BSI sensors and achieve practical yields.

“These in-house services include prototype and wafer probe development, qualification services, yield optimization, and production test and delivery,” says Loc Duc Truong, Vice President of Engineering, Forza Silicon. “Together, these capabilities have enabled us to overcome the manufacturing challenges associated with BSI sensors.”

The high-speed BSI sensor design is the result of a collaboration between Forza Silicon and Vision Research, a leading manufacturer of digital high-speed imaging systems. By designing the photoactive surface above the circuitry, the sensor increases the pixel surface area that can capture photons in light-starved conditions, bringing two significant advantages to high-speed applications: improved fill factor and improved processing speed.

To learn more, please visit: www.forzasilicon.com.

You may also like:

  • PCB mills
    Basics of printed circuit board milling machines
  • Did you foresee Facebook?
    Did you foresee Facebook?
  • 9-11 truthers
    The WTC collapse after two decades
  • scilab
    The top ten free engineering math software packages
  • don't worry about EV fires
    Don’t worry about EV fires

Filed Under: Product Design & Development
Tagged With: forza
 

Related Articles Read More >

2022-347-348_AS_10K3
Corrosion protection for oil and gas equipment from General Magnaplate
Honeywell announces Spring 2022 release of new offerings to Honeywell Forge
unnamed-33
igus introduces new geometries and new materials to its FastLine service
EXAIR’s CE Compliant Chip Vac

DESIGN GUIDE LIBRARY

“motion

Enews Sign Up

Motion Control Classroom

Design World Digital Edition

cover

Browse the most current issue of Design World and back issues in an easy to use high quality format. Clip, share and download with the leading design engineering magazine today.

EDABoard the Forum for Electronics

Top global problem solving EE forum covering Microcontrollers, DSP, Networking, Analog and Digital Design, RF, Power Electronics, PCB Routing and much more

EDABoard: Forum for electronics

Sponsored Content

  • Global supply needs drive increased manufacturing footprint development
  • How to Increase Rotational Capacity for a Retaining Ring
  • Cordis high resolution electronic proportional pressure controls
  • WAGO’s custom designed interface wiring system making industrial applications easier
  • 10 Reasons to Specify Valve Manifolds
  • Case study: How a 3D-printed tool saved thousands of hours and dollars

Design World Podcasts

May 17, 2022
Another view on additive and the aerospace industry
See More >
Engineering Exchange

The Engineering Exchange is a global educational networking community for engineers.

Connect, share, and learn today »

Design World
  • Advertising
  • About us
  • Contact
  • Manage your Design World Subscription
  • Subscribe
  • Design World Digital Network
  • Engineering White Papers
  • LEAP AWARDS

Copyright © 2022 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy | Advertising | About Us

Search Design World

  • Home
  • Technologies
    • 3D CAD
    • Electronics • electrical
    • Fastening & Joining
    • Factory automation
    • Linear Motion
    • Motion Control
    • Test & Measurement
    • Sensors
    • Fluid power
  • Learn
    • Ebooks / Tech Tips
    • Engineering Week
    • Future of Design Engineering
    • MC² Motion Control Classrooms
    • Podcasts
    • Videos
    • Webinars
  • LEAP AWARDS
  • Leadership
    • 2022 Voting
    • 2021 Winners
  • Design Guide Library
  • Resources
    • 3D Cad Models
      • PARTsolutions
      • TraceParts
    • Digital Issues
      • Design World
      • EE World
    • Women in Engineering
  • Supplier Listings