TDK Corporation introduces two new NTC thermistors designed for precise temperature measurement in automotive and industrial environments. The L862 and L871 series operate across a temperature range of -40°C to +155°C, with power dissipation rated at 60 mW at room temperature. The L862 features a 2.6 x 6.5 mm sensor element with silver-plated nickel wire […]
What is negative temperature coefficient?
A negative temperature coefficient (NTC) refers to any physical value that decreases as the temperature increases or vice versa. In electronics, NTC usually refers to a material’s decreasing resistance as the temperature rises. This article examines how NTC device performance is quantified and compares with other technologies like resistance temperature detectors (RTDs) and positive temperature […]
Stacking up standard and pallet conveyors
No matter what kind of products a manufacturing line produces, an effective conveyor belt system is key to ensuring safe and well-organized material handling that maintains the operation’s rhythm. Most conveyor systems achieve this with a combination of both standard and pallet conveyors at various stages of the line. Knowing how and where to use…
Industrial connectors deliver 630 V rating
Industrial circular connectors are electrical coupling devices featuring a circular interface and cylindrical contact housing. They come in various materials, sizes, contact layouts, and coupling designs. Among them, M8, M12, M16, ½”-20, and M23 receptacles, which refer to the thread size on the coupling nuts, are widely used for connecting sensors and actuators in industries […]
Cable-to-board connector withstands harsh environments
Hirose has expanded its FPC-to-board product offering to include a two-piece harsh environment connector that simplifies assembly while reducing the size and weight of end products. The compact ZK1 Series connector features a plug side with a terminal-less design that contributes to size and weight reduction by switching from discrete wire to FPC. FPC direct […]
How will neurotechnology and sensing impact automotive: part 2
Neuro data provides a level of insight into the driver’s condition and cognitive state that is not possible with a driver-facing camera.
Current sensing ICs reduce power loss with lower internal resistance
Allegro MicroSystems, Inc. announced the launch of two new current sensor ICs – the ACS37030MY and the ACS37220MZ. Leveraging Allegro’s cutting-edge sensing technology, these ICs provide low internal conductor resistance, high operating bandwidth, and reliable performance across a wide range of automotive, industrial, and consumer applications. Allegro’s new current sensor ICs are designed for precise […]
How will neurotechnology and sensing impact automotive: part 1
EEG sensing can improve driving safety.
What are the connector challenges in hypersonic missiles?
Connectors in hypersonic missiles need to be small and lightweight and provide robust signal integrity for high-speed connectivity. The challenge is to provide the required performance and durability while enduring extremely high temperatures and high levels of shock and vibration. This article briefly examines the inside of a hypersonic missile and its operating environment. It […]
Shunt monitor measures voltages across shunt resistors
Diodes Incorporated announces the ZXCT18xQ series of automotive-compliant* high-precision current shunt monitors. These single-stage instrumentation amplifiers accurately measure very small sense voltages across a wide range of common-mode voltages up to 26V while operating from a 2.7V to 5.5V supply. Automotive applications include ambient lighting control, battery management, heated seats, and other body control systems. The […]
How does ASIL SEooC affect sensors?
Automotive systems that impact safety require adherence to the automotive functional safety standard — ISO 26262. Those electronic and electrical systems that are interlinked to use the input from one sensor to provide different functions in the automobile and minimize system cost, have additional safety considerations. To ensure proper and verified capability, the hardware (HW), software […]
Coreless current sensor achieves 2 μs response time for EV applications
Melexis unveils the MLX91235, a new current sensor that eliminates the need for a ferromagnetic core. The MLX91235 expands Melexis’ portfolio, enabling the measurement of larger currents flowing through external primary conductors like PCB traces and busbars. It supports automotive and alternative mobility applications like inverters, battery management systems (BMSs), and low-voltage DC-DC converters. Power […]
Automotive sensor features encrypted SPI communication
LEM has introduced a residual current monitoring (RCM) type B sensor designed for bi-directional on-board chargers (OBCs) with ASIL B capabilities. The CDT sensor addresses safety requirements in vehicle-to-everything (V2X) applications, including vehicle-to-load, vehicle-to-grid, and vehicle-to-vehicle systems. Bi-directional OBCs enable users to power other vehicles, appliances, or homes from their EV battery pack. These systems require […]
Compact TSOT23-3L package Hall switch needs no external components
Melexis introduces the MLX92235, a low power Hall-effect switch with precise tolerances for consistent output update rate. The device serves automotive micropower applications including door handles, e-latches, sun visors, infotainment buttons, and brake light switches. Modern vehicles use switch and latch mechanisms across multiple systems for feedback. With switches distributed throughout cars, power efficiency is essential. The […]
Beckhoff strengthens packaging industry team in the US and globally
Following another successful PACK EXPO International, Beckhoff has announced the promotions of both Mark Ruberg and Greg Marsh. These changes will further strengthen the packaging industry management team and increase Beckhoff’s ability to support customer success in the U.S. and around the world. Marsh will serve as packaging industry manager for Beckhoff USA. Marsh has…
IP67-rated magnetic encoder serves construction and medical equipment uses
Novotechnik, U.S. introduces the MC-1 2800 44-Turn magnetic encoder with IO-Link output interface. Patented non-volatile technology retains turn count even when power is lost and reports correct count when power is restored. Key specifications for the MC-1 2800 include a measuring range of 15,840° (44 turns), and measured variable information of angle, turns, speed, and […]
The 2024 LEAP Awards winner for Switches & Sensors is Mobix Labs
The winners of the 2024 LEAP Awards (Leadership in Engineering Achievement Program) were announced yesterday across several categories. This year’s winner in the Switches & Sensors category is fabless semiconductor company, Mobix Labs. GOLD Mobix Labs SP10T RF Switch Mobix Labs has introduced the industry’s first high-power single-pole/ten-throw (SP10T) RF switch for the land mobile […]
The 2024 LEAP Awards winner for Switches & Sensors is Mobix Labs
The winners of the 2024 LEAP Awards (Leadership in Engineering Achievement Program) were announced yesterday across several categories. This year’s winner in the Switches & Sensors category is fabless semiconductor company, Mobix Labs. GOLD Mobix Labs SP10T RF Switch Mobix Labs has introduced the industry’s first high-power single-pole/ten-throw (SP10T) RF switch for the land mobile […]
The 2024 LEAP Awards winner for Switches & Sensors is Mobix Labs
The winners of the 2024 LEAP Awards (Leadership in Engineering Achievement Program) were announced yesterday across several categories. This year’s winner in the Switches & Sensors category is fabless semiconductor company, Mobix Labs. GOLD Mobix Labs SP10T RF Switch Mobix Labs has introduced the industry’s first high-power single-pole/ten-throw (SP10T) RF switch for the land mobile […]
Silicon Sensing, Science Tokyo conduct test program
Silicon Sensing Systems Ltd and Japan’s leading science and technology university, Science Tokyo, have collaboratively conducted a program to test the capabilities of the company’s DMU41 inertial measurement unit (IMU) for low earth orbit (LEO) space applications. The test program explored the use of the high-performance DMU41 for space platform guidance and attitude control in…
Dual-entry card-edge connectors rated up to 150VACRMS
KYOCERA AVX expanded its line of vertical card-edge connectors with the release of the new 9159-800 Series dual-entry card-edge connectors — the industry’s first dual-entry card-edge connectors and the lowest-profile card-edge connectors in the KYOCERA AVX portfolio. Engineered to satisfy growing cross-market demand for card-edge connectors and persistent cross-market demand for compact, space-saving connectors, the new […]
Able Electropolishing adds AS9100:2016 certification to list of industry quality standards
Able Electropolishing has been awarded AS9100:2016 certification for compliance with aerospace and defense industry quality management standards. Its customers include industry-leading aerospace, medical device, and automobile manufacturers. The AS9100:2016 standard requires rigorous on-site auditing and inspection, followed by annual surveillance audits to ensure adherence to all requirements, including conformity to customer, statutory, and regulatory requirements for…
Board-to-board connector support 28 Gbps links
Samtec announces the availability of its SLH/TLH Series printed circuit board (PCB) to board (B2B) connectors that offer an ultra-low mated stack height down to 2 mm (.078″) and support 28 Gbps NRZ performance. SLH/TLH PCB board-to-board connectors are part of Samtec’s Ultra Micro line of products that maximize overall space and offer reliable connections […]
Integrated sensor package simplifies brake pedal design
Melexis’ MLX90424 is a cost-effective solution simplifies automotive brake pedal sensing. For functional safety purposes, it integrates two position-sensing ICs and a wake-up switch all isolated in 1 package. The solution can be powered directly by the 12 V and handles precise measurements of linear displacement up to 30 mm. Reaching the state of the […]
Emerson to showcase packaging solutions at PACK EXPO 2024
Emerson will exhibit its latest Floor to Cloud packaging solutions at PACK EXPO Chicago, Nov 3-6, 2024. Advancing the boundless future of automation, Emerson factory automation solutions and its Floor to Cloud approach empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.…